Participation of 2017 HKPCA Exhibition

We plan to partake in the upcoming HKPCA Assembly Fair

* Fair Schedule: 2017 Dec. 6th~8th

In the impending Assembly Fair we plan to exhibit the InSmart Extreme(AOI), SSR-III(AOR) that can repair up to L/S = 10/10㎛ which employs the High End IC Substrate’s Embedded & Fan-out method.

Please come and visit our booth at Hall 1(1C21) for the detailed consultation.

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